PHOTONICALLY INTEGRATED CHIP, OPTICAL COMPONENT HAVING A PHOTONICALLY INTEGRATED CHIP, AND METHOD FOR THE PRODUCTION THEREOF

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United States of America Patent

SERIAL NO

15515486

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Abstract

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The invention relates, inter alia, to a photonically integrated chip (2) having a substrate (20), a plurality of material layers arranged on a top side (21) of the substrate (20), an optical waveguide which is integrated in one or more wave-guiding material layers of the chip (2), and a grating coupler (60) which is formed in the optical waveguide and causes beam deflection of radiation guided in the waveguide in the direction out of the layer plane of the wave-guiding material layer(s) or causes beam deflection of radiation to be coupled into the waveguide in the direction into the layer plane of the wave-guiding material layer(s).

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Patent Owner(s)

Patent OwnerAddress
TECHNISCHE UNIVERSITAT BERLIN10623 BERLIN
SICOYA GMBH12489 BERLIN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HENNIGES, Marvin Berlin, DE 2 8
MERSTER, Stefan Berlin, DE 1 5
RHEE, Hanjo Berlin, DE 12 48
RICHTER, Harald H Frankfurt (Oder), DE 1 5
SELICKE, David Altlandsberg, DE 2 11
STOLAREK, David Frankfurt (Oder), DE 2 6
THEISS, Christoph Berlin, DE 7 33
ZIMMERMANN, Lars Berlin, DE 15 43

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