SEALING MATERIAL COMPOSITION, SEALING SHEET, MEMBER FOR ELECTRONIC DEVICE, AND ELECTRONIC DEVICE

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United States of America Patent

SERIAL NO

15519235

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention is a sealing material composition comprising a moisture absorbent, and a sealing resin having a weight average molecular weight of 50,000 to 1,000,000, the moisture absorbent comprising a compound that comprises a repeating unit represented by a formula (1), and

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Patent Owner(s)

Patent OwnerAddress
LINTEC CORPORATION23-23 HONCHO ITABASHI-KU TOKYO 1730001

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
NISHIJIMA, Kenta Tokyo, JP 15 42

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