LASER MANUFACTURING OF SOLDER PREFORMS

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United States of America Patent

SERIAL NO

15435856

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Methods of making solder preforms are disclosed. A ribbon of raw material is received, and a first annular solder preform is formed by laser cutting the ribbon. The edges of the first annular solder preform can then be cleaned. The cutout section removed from the middle of the first annular solder preform can then be laser cut to form a second annular solder preform that is smaller than the first annular solder preform.

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Patent Owner(s)

Patent OwnerAddress
MATERION CORPORATION6070 PARKLAND BOULEVARD MAYFIELD HEIGHTS OH 44124

International Classification(s)

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  • 2017 Application Filing Year
  • H01L Class
  • 30754 Applications Filed
  • 25260 Patents Issued To-Date
  • 82.14 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2017201820192020202120222023202420250255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kothandapani, Ramesh Singapore, SG 9 21
Lee, Chee Kong Singapore, SG 9 16
Tan, SinLi Johor, MY 2 2

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Patent Citation Ranking

  • 0 Citation Count
  • H01L Class
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  • 8 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges26979357140748325312788503629173801 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +050010001500200025003000350040004500500055006000650070007500800085009000950010000

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