Optoelectronic Semiconductor Chip and Method for Producing the Same

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United States of America Patent

SERIAL NO

15502473

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Abstract

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An optoelectronic semiconductor chip and a method for producing the same are disclosed. In an embodiment an optoelectronic semiconductor chip includes a support substrate, a semiconductor layer sequence having a first semiconductor region of a first conductivity type, a second semiconductor region of a second conductivity type and an active layer arranged therebetween, and a mirror layer arranged between the support substrate and the semiconductor layer sequence. The chip further includes a dielectric encapsulation layer arranged at least partly between the semiconductor layer sequence and the support substrate and a transparent dielectric cover layer partially covering a region of the encapsulation layer, wherein the mirror layer and side flanks of the mirror layer are covered by an electrically conductive protective layer.

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Patent Owner(s)

Patent OwnerAddress
OSRAM OPTO SEMICONDUCTORS GMBHLEIBNIZSTRASSE 4 REGENSBURG 93055

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Weiss, Guido Regensburg, DE 17 21

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