Device with top-side base plate
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United States of America Patent
Stats
-
May 19, 2020
Grant Date -
Aug 17, 2017
app pub date -
Feb 16, 2017
filing date -
Feb 16, 2016
priority date (Note) -
In Force
status (Latency Note)
Importance
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Abstract
A device includes an integrated circuit (IC) die, a top-side base plate to which the IC die is mounted, and a body attached to the top-side base plate such that the IC die is inside the body, the body configured for attachment to a printed circuit board (PCB) such that the top-side base plate faces away from the PCB. The device may or may not include legs that abut the PCB upon installation.
First Claim
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International Classification(s)
- 2017 Application Filing Year
- H01L Class
- 30754 Applications Filed
- 25260 Patents Issued To-Date
- 82.14 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- H01L Class
- 0 % this patent is cited more than
- 5 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Nov 19, 2027 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Nov 19, 2031 |
