ELECTRICALLY CONDUCTIVE SHEET MOLDING COMPOUND
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
N/A
app pub date -
Aug 12, 2015
filing date -
Aug 12, 2014
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
An electrically conductive fiber reinforced thermosetting resin molding compound which includes a microencapsulated curing agent is provided. Any electrically conductive fillers, including carbon fillers and metal fillers, may be used to impart electrical conductivity to the fiber reinforced thermosetting resin molding compound.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully