CIRCUIT BOARD STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
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United States of America Patent
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Issued Date -
Aug 10, 2017
app pub date -
May 16, 2016
filing date -
Feb 4, 2016
priority date (Note) -
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Abstract
A circuit board structure includes a circuit board and an adhesive layer. The circuit board has a first board surface and an opposite second board surface, and the first board surface defines a predetermined portion. The circuit board has a conductive circuit disposed on the first board surface and at least partially arranged on the predetermined portion. The adhesive layer is seamlessly formed on the predetermined portion of the first board surface of the circuit board, and the conductive circuit arranged on the predetermined portion is seamlessly covered by the adhesive layer. A surface of the adhesive layer arranged away from the circuit board is a planar bonding surface.
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