DOUBLE-SIDED CIRCUIT SUBSTRATE SUITABLE FOR HIGH-FREQUENCY CIRCUITS

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United States of America Patent

SERIAL NO

15501949

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Abstract

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Provided is a double-sided circuit substrate being a laminate of: a composite material comprising a fluorine resin and a glass cloth; and a copper foil having a two-dimensional roughness Ra in a mat surface (a surface that comes in contact with the resin) of less than 0.2 μm. Ideally, a surface of the fluorine resin has an O content of at least 1.0%, as observed using ESCA.

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Patent Owner(s)

Patent OwnerAddress
DAIKIN INDUSTRIES LTDOSAKA JAPAN OSAKA
NIPPON KAYAKU KABUSHIKI KAISHANO 1 ERDING MU 1 TAKESHI WAN CHIYODA TOKYO JAPAN TOKYO TOKYO METROPOLIS

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
AKATUKA, Yasumasa Tokyo, JP 3 12
INABA, Takeshi Osaka, JP 57 350
KOMORI, Hirokazu Osaka, JP 76 263
MOTEKI, Shigeru Tokyo, JP 14 91

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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges392138724467261388321101 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +0100200300400500600700800900100011001200130014001500

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