BACKSIDE ILLUMINATED IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME
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United States of America Patent
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Issued Date -
Aug 10, 2017
app pub date -
Jan 24, 2017
filing date -
Feb 4, 2016
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Abstract
A backside illuminated image sensor includes a substrate having a frontside surface and a backside surface, a photodiode disposed in the substrate, an insulating layer disposed on the backside surface and a fixed charge layer disposed on the insulating layer. A charge accumulation region capable of being used as a backside pinning layer is formed between the photodiode and the backside surface of the substrate by the fixed charge layer.
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