RESIST UNDERLAYER FILM-FORMING COMPOSITION CONTAINING NOVOLAC RESIN REACTED WITH AROMATIC METHYLOL COMPOUND
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United States of America Patent
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Aug 10, 2017
app pub date -
Aug 4, 2015
filing date -
Aug 8, 2014
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Abstract
A resist underlayer film for lithography has high solubility in a resist solvent (solvent used in lithography) for expressing good coating film forming property and a smaller selection ratio of dry etching rate as compared with a resist. A resist underlayer film-forming composition containing a novolac resin containing a structure (C) obtained by a reaction of an aromatic ring of an aromatic compound (A) with a hydroxy group-containing aromatic methylol compound (B). The aromatic compound (A) may be a component constituting the structure (C) in the novolac resin. The hydroxy group-containing aromatic methylol compound (B) may be a compound of Formula (1):
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