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United States of America Patent
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Sep 21, 2015
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Sep 22, 2014
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Abstract
This invention relates to an epoxy resin formulation containing a curative that can be cured at 150° C. to 95% cure in no more than 150 seconds, and can be cured at 120° C. to 95% cure in no more than 4 minutes. This results in a cured resin having a Tg no greater than 140° C. wherein the formulation further contains a mould release agent.
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