Bonded article and method for manufacturing bonded article

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United States of America Patent

PATENT NO 9849539
SERIAL NO

15514633

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A method for manufacturing a bonded article having long bonding length and high strength. A first bonding target member and a second bonding target member having a hole portion for receiving the first member are provided. Pressing force is applied between the two members with the first member received in the hole portion, and a current is applied to a bonding target portion between the two members with the pressing force applied. The two members are of materials with different melting points. One of the two members, having lower melting point, has a heat capacity increasing portion in the vicinity of the target portion. The one of the members has a taper face at the target portion, and the heat capacity increasing portion has a face extending from the taper face. The force applying step is performed with the other member positioned not to contact the heat capacity increasing portion.

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Patent Owner(s)

Patent OwnerAddress
ORIGIN COMPANY LIMITEDSAITAMA-SHI SAITAMA 338-0823

International Classification(s)

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  • 2015 Application Filing Year
  • B23K Class
  • 2354 Applications Filed
  • 1765 Patents Issued To-Date
  • 74.98 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances20152016201720182019202020212022202320240255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kadoya, Yasuo Saitama, JP 11 14
Sasaki, Hiroji Saitama, JP 5 22

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Patent Citation Ranking

  • 1 Citation Count
  • B23K Class
  • 28.92 % this patent is cited more than
  • 8 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges37181569129411101 - 1011 - 2021 - 3031 - 4041 - 5051 - 6071 - 8081 - 90050100150200250300350400450500550600650700750800850900

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