Gate Metal Structure for Compound Semiconductor Devices

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United States of America Patent

APP PUB NO 20170222011A1
SERIAL NO

15138463

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An improved gate metal structure for compound semiconductor devices comprises sequentially a compound semiconductor substrate, a Schottky barrier layer, an insulating layer and a gate metal. The insulating layer has a gate recess. The surrounding and the bottom of the gate recess are defined by the insulating layer and the Schottky barrier layer respectively. The gate metal includes a contact layer formed on the insulating layer, covering the gate recess and contacted with the Schottky barrier layer at the bottom of the gate recess; a first diffusion barrier layer formed on the contact layer; a second diffusion barrier layer formed on the first diffusion barrier layer; and a conduct layer formed on the second diffusion barrier layer. Thereby the reliability of the compound semiconductor devices is enhanced.

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Patent OwnerAddress
WIN SEMICONDUCTORS CORPNO 69 KEJI 7TH RD GUISHAN DIST TAOYUAN CITY 33383

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHO, Kai-Sin Tao Yuan City, TW 1 1
HUA, Chang-Hwang Tao Yuan City, TW 32 419
WOHLMUTH, Walter Tony Tao Yuan City, TW 15 11

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