Wafer defect inspection and review systems
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United States of America Patent
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May 19, 2020
Grant Date -
Aug 3, 2017
app pub date -
Sep 28, 2016
filing date -
Feb 3, 2016
priority date (Note) -
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Abstract
Imaging objectives and inspection systems equipped with such imaging objectives are disclosed. The imaging objective may include a front objective configured to produce a diffraction limited intermediate image. The imaging objective may also include a relay configured to receive the intermediate image produced by the front objective. The relay may include three spherical mirrors positioned to deliver a projection of the intermediate image to a fixed image plane.
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