Instrumented substrate apparatus for acquiring measurement parameters in high temperature process applications
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United States of America Patent
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Oct 19, 2021
Grant Date -
Aug 3, 2017
app pub date -
Sep 27, 2016
filing date -
Feb 2, 2016
priority date (Note) -
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Abstract
An apparatus includes a substrate, a nested enclosure assembly including an outer enclosure and an inner enclosure, wherein the outer enclosure encloses the inner enclosure and the inner enclosure encloses at least the electronic assembly. An insulating medium is disposed within a cavity between the outer surface of the inner enclosure and the inner surface of the outer enclosure and the system includes a sensor assembly communicatively coupled to the electronic assembly. The sensor assembly includes one or more sensors that are configured to acquire one or more measurement parameters at one or more locations of the substrate. The electronic assembly is configured to receive the one or more measurement parameters from the one or more sensors.
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