THERMALLY CONDUCTIVE POLYMER ARTICLES FOR ELECTRONIC CIRCUITRY
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United States of America Patent
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Issued Date -
Aug 3, 2017
app pub date -
Oct 5, 2015
filing date -
Oct 7, 2014
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Abstract
A thermally conductive polymer article is disclosed, made from a polymer resin and thermally conductive additives, wherein the article has undergone laser structuring and plasma metallization and, preferably, surface-mount technology (SMT) by non-lead reflow soldering, to provide an integrated circuit. The article can be in the shape of a printed circuit board or a LED lighting component among other possibilities. The thermally conductive additive can be either electrically insulative or electrically conductive, or both types can be used. The thermally conductive polymer compound can be extruded, molded, calendered, thermoformed, or 3D-printed before taking shape as a heat dissipating, laser structured, and plasma metalized polymer article.
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