Curable Silicone Resin Composition, Cured Object Obtained Therefrom, and Optical Semiconductor Device Formed Using Same
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United States of America Patent
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Jul 10, 2015
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Jul 24, 2014
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A curable silicone resin composition according to the present invention includes at least the following components: (A) a silicone resin having a hydrogen atom bonded to silicon atom (as SiH group); (B) a silicone resin having a vinyl group bonded to silicon atom (as Si—CH═CH2 group); and (C) a platinum catalyst, wherein the total amount of silanol (Si—OH) group in the components (A) and (B) is 0.5 to 5.0 mmol/g; and wherein the amount of platinum in the component (C) relative to the total mass of the components (A), (B) and (C) is 0.003 to 3.0 ppm in mass units. A cured product obtained by heating the composition is suitably usable as an encapsulant of an optical semiconductor device.
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