THROUGH SUBSTRATE VIAS USING SOLDER BUMPS
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United States of America Patent
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app pub date -
Jan 26, 2017
filing date -
Jan 29, 2016
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Abandoned
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Abstract
A through substrate via is formed by disposing a quantity of solder material at the top of a through hole formed in a substrate, coating the hole with a wetting layer, and melting the solder material such that it flows into the hole. The solder material may alloy with the wetting layer, freezing upon formation of the alloy. Subsequent processing steps may be performed at temperatures higher than the melting point of the solder material.
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