Microfluidic package and method of making the same

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United States of America Patent

PATENT NO 10717079
APP PUB NO 20170216840A1
SERIAL NO

15415675

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Abstract

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The present invention relates to encapsulated microfluidic packages and methods thereof. In particular embodiments, the package includes a device, a cradle configured to support the device, and a lid having a bonding surface configured to provide a fluidic seal between itself and the device and/or cradle. Other package configurations, as well as methods for making such fluidic seals, are described herein.

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Patent Owner(s)

Patent OwnerAddress
NATIONAL TECHNOLOGY & ENGINEERING SOLUTIONS OF SANDIA LLCP O BOX 5800 MS-0161 ALBUQUERQUE NM 87185-0161

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Branch, Darren W Albuquerque, US 25 453
Edwards, Thayne L Albuquerque, US 21 392
Miller, Philip R Albuquerque, US 10 86
Wheeler, David R Albuquerque, US 51 510

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