METHOD OF FORMING SOLDER BUMPS ON SOLID STATE MODULE INCLUDING PRINTED CIRUCUIT BOARD
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United States of America Patent
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Issued Date -
Jul 27, 2017
app pub date -
Jan 22, 2016
filing date -
Jan 22, 2016
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method is provided for forming solder bumps on at least one module including a printed circuit board (PCB), electronic circuitry, and metal pads connected to the electronic circuitry. The metal pads are arranged in a predetermined pattern on a surface of the PCB. The method includes providing a planar structure including a non-wettable surface; placing a stencil over the non-wettable surface, the stencil defining openings corresponding to the metal pads; applying solder paste through the openings in the stencil to provide corresponding solder paste deposits on the non-wettable surface; removing the stencil; placing the at least one module on the solder paste deposits, such that the metal pads align with the solder paste deposits, respectively; and reflowing the solder paste deposits to form corresponding solder bumps, which respectively adhere to the metal pads of the at least one module and not to the non-wettable surface of the planar structure.
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