Method and System for Forming Patterns Using Charged Particle Beam Lithography with Variable Pattern Dosage

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United States of America Patent

APP PUB NO 20170213698A1
SERIAL NO

15481677

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Abstract

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A method and system for fracturing or mask data preparation or optical proximity correction or proximity effect correction or mask process correction is disclosed in which a set of shaped beam shots is determined that is capable of forming a pattern on a surface, where the set of shots provides different dosages to different parts of the pattern, and where the dose margin from the set of shots is calculated. A method for forming patterns on a surface is also disclosed.

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Patent Owner(s)

Patent OwnerAddress
D2S INC4040 MOORPARK AVE SUITE 250 SAN JOSE CA 95117

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fujimura, Akira Saratoga, US 225 2554
Zable, Harold Robert Palo Alto, US 35 376

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