VEHICLE LAMP DEVICE AND LIGHT-EMITTING MODULE THEREOF
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United States of America Patent
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Issued Date -
Jul 27, 2017
app pub date -
Jun 7, 2016
filing date -
Jan 27, 2016
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Abstract
Disclosed is a light-emitting module, comprising: a circuit board, a conductive layer, an LED chip, and an adhesive layer. The circuit board comprises a chip-attachment area, the conductive layer being disposed on the chip-attachment area, the LED chip being disposed on the conductive layer and electrically connected to the circuit board through the conductive layer, and the adhesive layer being used for connecting the LED chip to the circuit board, wherein a curing temperature of the adhesive layer is lower than a melting point of the conductive layer. Adopting the aforementioned technical means, the degree of offset in the position of the LED chip after reflow soldering can be greatly reduced. In addition, a vehicle lamp device using the light-emitting module is also provided.
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