Thermally and electrically conductive adhesive composition
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United States of America Patent
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Apr 28, 2020
Grant Date -
Jul 27, 2017
app pub date -
May 28, 2015
filing date -
May 29, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
The present invention relates to a thermally and electrically conductive adhesive composition, which includes (A) an electrically conductive filler, (B) an epoxy resin, (C) a reactive diluent, and (D) a curing agent, wherein the component (A) is a silver powder having an average particle diameter of 1 to 10 μm, the component (B) has two or more epoxy functional groups and aromatic rings in each molecule, the component (C) is a compound having two or more glycidyl ether functional groups in an aliphatic hydrocarbon chain and also having a molecular weight of 150 to 600, and the component (D) is a compound having two or more phenol functional groups in each molecule, a compound having two or more aniline functional groups in each molecule, or a mixture of these compounds, and the content of each of the components (A), (B), (C), and (D) is within a specific range.
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International Classification(s)
- C09K:MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED ....
- C09J:ADHESIVES; ADHESIVE PROCESSES IN GENERAL
- H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
- C08G:MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN B....
- H01B:CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATER....
- C08K:USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUB....
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