TEMPURA BATTER MIX

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United States of America Patent

APP PUB NO 20170208845A1
SERIAL NO

15326084

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Abstract

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Provided is a tempura batter mix that has a good adhesion property to ingredients and makes it possible to prepare, by a simple procedure, tempura having a coating with a crisp texture and a fluffy voluminous appearance. The tempura batter mix comprises a heat-moisture-treated wheat flour having a degree of gelatinization of 12.5 to 30% and having a viscosity of 1 to 10 Pa•s when the heat-moisture-treated wheat flour is added with 300% by mass of water based on the mass of the flour; and at least one emulsifying agent selected from the group consisting of a polyglycerol fatty acid ester, a sucrose fatty acid ester, lecithin, and an organic acid monoglyceride.

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Patent Owner(s)

Patent OwnerAddress
NISSHIN FOODS INCTOKYO JAPAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
FUJIMURA, Ryosuke Chuo-ku, JP 31 26
NISHIDE, Tatsunori Chuo-ku, JP 6 0

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