OPTICAL MODULE

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United States of America Patent

SERIAL NO

15269179

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The disclosure discloses an optical module, and relates to the field of optic fiber communications. A circuit according to an embodiment of the disclosure includes: a chip, which includes at least one wiring side, and on which there are arranged first signal interface pads arranged parallel to the wiring side; a circuit board on which there are arranged a number of second signal interface pads corresponding to the first signal interface pads, wherein at least two of the distances between the respective second signal interface pads and the wiring side are different from each other; and signal wires configured to connect the corresponding first signal interface pads and second signal interface pads.

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Patent Owner(s)

Patent OwnerAddress
HISENSE USA CORPORATION7310 MCGINNIS FERRY ROAD SUWANEE GA 30024
HISENSE INTERNATIONAL CO LTDNO 218 QIANWANGANG ROAD ECONOMIC AND TECHNICAL DEVELOPMENT ZONE QINGDAO SHANDONG 266555

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
BEN, Shijian Qingdao, CN 6 10
HUANG, Yongliang Qingdao, CN 17 16
XIA, Jingsheng Qingdao, CN 4 7
YANG, Sigeng Qingdao, CN 22 35

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