INTEGRATED CIRCUITS WITH HIGH VOLTAGE AND HIGH DENSITY CAPACITORS AND METHODS OF PRODUCING THE SAME
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United States of America Patent
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N/A
Issued Date -
N/A
app pub date -
Jan 14, 2016
filing date -
Jan 14, 2016
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
Integrated circuits and methods of producing the same are provided. In an exemplary embodiment, an integrated circuit includes a high voltage capacitor having a first high voltage plate, a second high voltage plate directly overlying the first high voltage plate, and a high voltage dielectric film between the first and second high voltage plates. The integrated circuit also includes a high density capacitor with a first high density plate that is about co-planar with the second high voltage plate, a second high density plate directly overlying the first high density plate, and a thin high density dielectric film positioned between the first and second high density plates.
First Claim
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