METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PACKAGE
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United States of America Patent
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Jul 20, 2017
app pub date -
Dec 12, 2016
filing date -
Jan 15, 2016
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Abstract
A method for manufacturing a semiconductor package includes: forming an insulating layer on a support plate; forming a via in the insulating layer; locating a semiconductor device on the insulating layer such that an electrode of the semiconductor device is on the via; removing the support plate; forming a seed layer on a surface of the insulating layer opposite to the semiconductor device, in the via, and on a surface of the electrode of the semiconductor device; and forming a metal layer in the via.
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