HYBRID SYSTEM INTEGRATING PACKAGE-ON-PACKAGE SOC AND EMBEDDED MULTI-CHIP PACKAGE ON ONE MAIN CIRCUIT BOARD
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jul 20, 2017
app pub date -
Oct 19, 2016
filing date -
Jan 19, 2016
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A hybrid system includes a printed circuit board (PCB) having a main surface, a package-on-package (PoP) having a bottom package mounted on the main surface of the PCB and a top package stacked on the bottom package, and a multi-chip package (MCP) on the main surface of the PCB. The bottom package includes a system-on-chip (SoC) and the top package includes at least one on-package dynamic random access memory (DRAM) die accessible to the SoC. The MCP includes at least one on-board DRAM die accessible to the SoC via a PCB trace.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully