METHOD FOR PLATING NONWOVEN FABRIC BY USING CONTINUOUS ELECTROLESS AND ELECTROLYTIC PLATING PROCESSES

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United States of America Patent

SERIAL NO

15326583

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Abstract

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The present invention relates to: a method for plating nonwoven fabric with metals (copper and nickel, or nickel and nickel) by electroless and electrolytic continuous processes; and a nonwoven fabric plated by the method. The present invention can prepare a metal-plated nonwoven fabric by electrolytic plating a space of metal ions, which are formed by performing electroless plating with copper or nickel, with nickel in a short amount of time, thereby filling up the space, and thus has excellent conductivity while being thin. A desired conductivity can be obtained by changing the composition of a plating solution or controlling the plating velocity, and a line capable of performing plating with copper and nickel, nickel and nickel, nickel alone, or copper alone, in combination, can be manufactured. In addition, a highly conductive nonwoven fabric having no difference in plating thickness of nonwoven fabric performed by only electroless plating can be produced.

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Patent Owner(s)

Patent OwnerAddress
BULLSONE MATERIAL CO LTD2FL 10LOT 67 BLOCK 110 NAMDONG-DAERO 199BEON-GIL NAMDONG-GU INCHEON 405-817
CLEAN & SCIENCE CO LTD903-1 511 YEONGDONG-DAERO GANGNAM-GU SEOUL 06164

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHANG, Min Hwan Jeonju-si, KR 1 4
HUR, Soo Hyung Seoul, KR 4 8
KANG, Byung Rok Incheon, KR 4 8
KANG, Ji Hun Chungcheongnam-do, KR 35 36
KANG, Seung Won Gyeongsangbuk-do, KR 10 37
KWAG, Gyu Beom Seoul, KR 2 4
LEE, Jong Gil Incheon, KR 8 16
LEE, Nam Kwi Jeollabuk-do, KR 1 4
PARK, Min Young Incheon, KR 43 216

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