SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

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United States of America Patent

APP PUB NO 20170204509A1
SERIAL NO

15326031

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A substrate processing apparatus includes a plasma generation unit that generates a plasma from a process gas in a plasma generation space in which a substrate is placed. The substrate processing apparatus also includes a cooling unit opposed to the substrate with a cooling space located in between. The cooling unit includes a supply port that supplies the process gas to the cooling space. The substrate processing apparatus also includes a process gas supply unit that supplies the process gas to the cooling unit. The substrate processing apparatus further includes a communication portion that communicates the cooling space and the plasma generation space to supply the process gas, which has been supplied to the cooling space, to the plasma generation space.

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Patent Owner(s)

Patent OwnerAddress
ULVAC INCKANAGAWA JAPAN KANAGAWA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
FUJINAGA, Tetsushi Chigasaki-shi, JP 10 8
IHORI, Atsuhito Chigasaki-shi, JP 7 10
IWAI, Harunori Chigasaki-shi, JP 6 14
MATSUMOTO, Masahiro Chigasaki-shi, JP 228 2224
TANI, Noriaki Chigasaki-shi, JP 34 246

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