APPARATUS AND METHOD FOR PLACING COMPONENTS ON AN ELECTRONIC CIRCUIT
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United States of America Patent
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Issued Date -
Jul 20, 2017
app pub date -
Jan 15, 2016
filing date -
Jan 15, 2016
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Abstract
An apparatus and method for placing components on an electronic circuit is disclosed. An adhesive applicator applies an adhesive to the electronic circuit. A component pick-and-place head places a component on the adhesive. A heater supplies sufficient heat to the electronic circuit to melt the adhesive and an outer portion of a contact pin of the component.
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