ULTRASONIC PROBE AND METHOD OF MANUFACTURING THE SAME

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United States of America Patent

SERIAL NO

15201743

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Provided are an ultrasonic probe and a method of manufacturing the same. The ultrasonic probe includes: a first unit configured to generate an ultrasonic wave from a first electrical signal or generate a second electrical signal from an echo signal of the ultrasonic wave; a second unit configured to provide the first electrical signal to the first unit or receive the second electrical signal from the first unit; and a third unit configured to electrically connect the first unit to the second unit, the third unit comprising a plurality of conductive bumps spaced apart from one another and a non-conductive paste or film that surrounds the plurality of conductive bumps.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG MEDISON CO LTD3366 HANSEO-RO NAM-MYEON HONGCHEON-GUN GANGWON-DO 25108

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHOI, Min-seog Seoul, KR 43 764
KIM, Young-il Suwon-si, KR 173 1339
SONG, Jong-keun Yongin-si, KR 25 213

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