Flip-Chip Image Sensor Package
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United States of America Patent
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Issued Date -
Jul 13, 2017
app pub date -
Jan 12, 2016
filing date -
Jan 12, 2016
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A flip-chip image-sensor package includes a substrate, a coverglass, a conductive layer, and an image sensor. The substrate has an aperture therethrough and a first region and a second region each at least partially surrounding the aperture. The aperture has a first width defined by a boundary of the first region, and a second width defined by a boundary of the second region, wherein the second width exceeds the first width. The coverglass spans the aperture and is located on a top surface of the first region. The conductive layer adjoins the substrate. The image sensor is located beneath the coverglass and is electrically connected to the conductive layer.
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