METHOD FOR MANUFACTURING ARRAY SUBSTRATE
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United States of America Patent
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Issued Date -
Jul 13, 2017
app pub date -
Apr 25, 2016
filing date -
Jan 12, 2016
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Abstract
Provided is a method for manufacturing an array substrate, in which a planarization layer mask includes a strip pattern that is provided for forming a groove and has two opposite sides along which taper modification patterns are provided so as to reduce taper of a groove formed in a planarization layer, making a slope thereof less steep, thereby preventing shorting of signal lines caused by residues of metal or ITO in a subsequent operation and thus increasing product yield. For the groove associated portion of an array substrate involving an in-cell touch structure, there is no need to change line for the touch sensing lines so as to lower down the difficulty of the operation and increase product yield.
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