HEAT DISSIPATION SYSTEM

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United States of America Patent

SERIAL NO

15132809

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A heat dissipation system includes a first heat dissipation module, a second heat dissipation module and a thermoelectric cooler. The first heat dissipation module is in thermal contact with at least one heat source. The second heat dissipation module includes a fan and a heat sink. The fan of the second heat dissipation module is disposed on the heat sink. The thermoelectric cooler is spaced apart from the at least one heat source and is in thermal contact with the at least one heat source through the first heat dissipation module. The heat sink of the second heat dissipation module is in thermal contact with the thermoelectric cooler.

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Patent Owner(s)

Patent OwnerAddress
MSI COMPUTER (SHENZHEN) CO LTD518108 GUANGDONG CITY OF SHENZHEN PROVINCE SHIYAN TOWN TANGTOU VILLAGE LONGMA INFORMATION TECHNOLOGY INDUSTRIAL PARK SHENZHEN CITY GUANGDONG PROVINCE 518108

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHANG, Chia-Ming Taipei City, TW 220 956
CHEN, Cheng-Lung Taoyuan City, TW 22 92

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