HEAT DISSIPATION SYSTEM

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United States of America Patent

SERIAL NO

15099502

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A heat dissipation system includes a first heat dissipation module, a second heat dissipation module and a bridge heat pipe. The first heat dissipation module has a heat absorbing surface in thermal contact with a first heat source. The second heat dissipation module has a heat absorbing surface in thermal contact with a second heat source. The first heat dissipation module is disposed on the bridge heat pipe. The second heat dissipation module is pivoted to the bridge heat pipe for adjusting an angle between the heat absorbing surface of the first heat dissipation module and the heat absorbing surface of the second heat dissipation module.

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Patent Owner(s)

Patent OwnerAddress
MSI COMPUTER (SHENZHEN) CO LTD518108 GUANGDONG CITY OF SHENZHEN PROVINCE SHIYAN TOWN TANGTOU VILLAGE LONGMA INFORMATION TECHNOLOGY INDUSTRIAL PARK SHENZHEN CITY GUANGDONG PROVINCE 518108

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHEN, Cheng-Lung Taoyuan City, TW 22 92
WU, Ching-Chi Keelung City, TW 2 13

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