CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
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United States of America Patent
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Issued Date -
Jul 6, 2017
app pub date -
Mar 1, 2016
filing date -
Jan 6, 2016
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Abstract
A circuit board includes a core layer, at least one metal contraposition component and at least one build-up circuit structure. The metal contraposition component is disposed on the core layer. The build-up circuit structure is disposed on the core layer and covers the metal contraposition component by using a position of the metal contraposition component as a fiducial mark.
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