Metalized microphone lid with integrated wire bonding shelf
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United States of America Patent
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Jul 17, 2018
Grant Date -
Jul 6, 2017
app pub date -
Mar 20, 2017
filing date -
Nov 6, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
A MEMS microphone package and a method of manufacturing a MEMS microphone package having a lid and a substrate cap. The lid includes a wire bonding shelf that provides a surface internal to the MEMS microphone for connection points for internal wire bonds. One or more conductive traces deposited on the bonding shelf are provided to connect internal electronic components via the wire bonds to a substrate cap. The substrate cap is configured to connect to external devices or components. The internal electronic components include a MEMS microphone die and an application specific integrated circuit. The internal electronic components are configured to transmit signals to external electronics indicative of acoustic energy received by the MEMS microphone die by the configurations described herein.
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