TRACKPAD SEMICONDUCTOR PACKAGE OF SMART DEVICE AND MANUFACTURING METHOD OF SAME
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jul 6, 2017
app pub date -
Oct 3, 2016
filing date -
Jan 6, 2016
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
A trackpad semiconductor package according to the present invention includes a printed circuit board (PCB), a trackpad device stacked on the PCB, a conductive wire configured to connect the PCB and the trackpad device, a glass assembly directly attached to the trackpad device using a die attach film, and an epoxy molding compound (EMC) mold configured to protect a partial region of the trackpad device that is not covered by the glass assembly and the conductive wire. According to the present invention, a sensing sensitivity is greatly improved.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully