TRACK PAD SEMICONDUCTOR PACKAGE USING COMPRESSION MOLDING AND METHOD FOR MANUFACTURING THE SAME
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Jan 3, 2017
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Jan 6, 2016
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Provided is a method for manufacturing a track pad semiconductor package using compression molding, including: preparing an original glass assembly; attaching each track pad element on an original PCB; bonding a wire between the original PCB and the track pad element; bonding the original glass assembly onto the track pad element using compression molding of the EMC; and singulating the compression-molded original PCB. According to the configuration of the present disclosure, fingerprint recognizing sensitivity is significantly improved while minimizing the entire thickness of the package.
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