HEAT DISSIPATION DEVICE AND THERMOELECTRIC COOLING MODULE THEREOF
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United States of America Patent
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Issued Date -
Jul 6, 2017
app pub date -
Apr 19, 2016
filing date -
Dec 30, 2015
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Abstract
A thermoelectric cooling module includes a base, a thermoelectric cooler and a plurality of heat exchangers. The base includes a case and a cover. The case has an inlet and an outlet. The cover covers the case. The cover and the case together define an accommodation space. The inlet and the outlet are connected with the accommodation space for a heat transfer fluid to flow in and out of the accommodation space. The thermoelectric cooler is in thermal contact with the cover for exchanging heat with the cover. The heat exchangers are disposed on and in thermal contact with the cover. The heat exchangers extend from the cover into the accommodation space for exchanging heat with the heat transfer fluid in the accommodation space.
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