Adhesion Promoter, Curable Silicone Composition, And Semiconductor Device

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United States of America Patent

APP PUB NO 20170190879A1
SERIAL NO

15315747

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Abstract

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An adhesion promoter represented by the average formula; a curable silicone composition comprising: (A) an organopolysiloxane having at least two alkenyl groups in a molecule, (B) an organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule, (C) the adhesion promoter, and (D) a hydrosilylation reaction catalyst; and a semiconductor device in which a semiconductor element is encapsulated with a cured product of the curable silicone composition. A novel adhesion promoter, a curable silicone composition that contains the adhesion promoter and that forms a cured product having excellent adhesion to various base materials, and an optical semiconductor device that is formed from the curable silicone composition and that has excellent reliability are provided.

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Patent Owner(s)

Patent OwnerAddress
DOW CORNING TORAY CO LTD5-1 OTEMACHI 1-CHOME CHIYODA-KU TOKYO 100-0004

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Furukawa, Haruhiko Ichihara-shi, JP 103 933
Iimura, Tomohiro Ichihara-shi, JP 74 474
Inagaki, Sawako Ichihara-shi, JP 8 24
Miyamoto, Yusuke Ichihara-shi, JP 69 672
Toda, Nohno Ichihara-shi, JP 11 37

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