Bonding of composite materials

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10773508
APP PUB NO 20170190165A1
SERIAL NO

15462817

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Importance

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Abstract

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Peel ply for surface preparation and a method of surface preparation prior to adhesive bonding. A resin-rich peel ply is applied onto a curable, resin-based composite substrate, followed by co-curing. After co-curing, the composite substrate is fully cured but the matrix resin in the peel ply remains partially cured. When the peel ply is removed, a roughened, bondable surface with chemically-active functional groups is revealed. The composite substrate with the chemically-active, bondable surface may be bonded to another composite substrate to form a covalently-bonded structure.

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Patent Owner(s)

Patent OwnerAddress
CYTEC INDUSTRIES INC504 CARNEGIE CENTER PRINCETON NJ 08540 NJ 08540

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kohli, Dalip Churchville, US 7 89
MacAdams, Leonard Woolwich Township, US 11 46

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