STRUCTURE AND METHOD OF FAN-OUT STACKED PACKAGES
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Dec 14, 2016
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Dec 23, 2015
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A fan-out stacked packages are formed by stacking a plurality of tiers followed by singulation process. Each tier comprises a plurality of units. Each unit comprises at least one chip, an encapsulation encapsulating the at least one chip, and a redistribution layer. The redistribution layer is electrically connected to the bond pads of the chip. A dielectric layer is formed on the redistribution layer. Adhesive pads are used to attach the plurality of tiers to each other. The redistribution layers of the units have a plurality of trace breakpoints electrically connected to each other using lateral traces formed on the sidewalls of the units.
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