METHOD FOR MAKING AN INTEGRATED CIRCUIT (IC) PACKAGE WITH AN ELECTRICALLY CONDUCTIVE SHIELD LAYER
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United States of America Patent
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Issued Date -
Jun 29, 2017
app pub date -
Dec 29, 2015
filing date -
Dec 29, 2015
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Abstract
A method for making at least one integrated circuit (IC) package includes positioning an electrically conductive shield layer adjacent an interior of a mold, and coupling the mold onto a substrate carrying at least one IC thereon. A molding material is supplied into the interior of the mold to form an encapsulated body over the at least one IC and substrate with the electrically conductive shield layer at an outer surface of the encapsulated body.
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