SUBSTRATE PROCESSING APPARATUS

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United States of America Patent

APP PUB NO 20170186634A1
SERIAL NO

15071606

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A substrate processing apparatus, including: a process chamber configured to process a substrate, a transfer chamber adjoining the process chamber, a shaft installed in the transfer chamber, a substrate mounting stand connected to the shaft and including a heating part, a first thermal insulation part installed in a wall of the transfer chamber at a side of the process chamber, and a second thermal insulation part installed in the shaft at a side of the substrate mounting stand.

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Patent Owner(s)

Patent OwnerAddress
HITACHI KOKUSAI ELECTRIC INC15-12 NISHI-SHIMBASHI 2-CHOME MINATO-KU TOKYO 105-8039

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
OHASHI, Naofumi Toyama-shi, JP 148 697
UENO, Masaaki Toyama-shi, JP 56 1414
YANAGISAWA, Yoshihiko Toyama-shi, JP 19 51

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