An interposer structure and a manufacturing method thereof are provided. The interposer structure includes a flexible substrate, a plurality of conductive pillars, a first patterned conductive layer, and a second patterned conductive layer. The flexible substrate includes a first surface and a second surface opposite to the first surface and has a plurality of through holes extending from the first surface to the second surface. A material of the flexible substrate is an insulator. The conductive pillars are disposed in the through holes. The first patterned conductive layer is disposed on the first surface of the flexible substrate and is electrically connected to the conductive pillars. The second patterned conductive layer is disposed on the second surface of the flexible substrate and is electrically connected to the conductive pillars.

Claims data not available