HIGH THERMAL CONDUCTIVITY CO-INJECTION MOLDING SYSTEM

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United States of America Patent

SERIAL NO

15415338

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Abstract

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A low constant pressure co-injection molding machine forms molded parts by injecting molten thermoplastic material into a mold cavity at low, substantially constant pressures. As a result, the low constant pressure injection molding machine includes a mold formed of easily machineable material that is less costly and faster to manufacture than typical injection molds. Co-injection of thin-walled parts having an L/T ratio >100, with embedded sustainable materials, such as polylactic acid (PLA), starch, post-consumer recyclables (PCR), and post-industrial recyclables (PIR) isolated from surfaces by barrier layers of leach-resistant material having a thickness less than 0.5 mm, is possible.

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Patent Owner(s)

Patent OwnerAddress
IMFLUX INC3550 SYMMES ROAD HAMILTON OH 45015

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Altonen, Gene Michael Hamilton, US 146 1322
Berg,, JR Charles John Wyoming, US 48 1222
Boswell, Emily Charlotte Cincinnati, US 65 1069
Layman, John Moncrief Liberty Township, US 54 554
Neufarth, Ralph Edwin Liberty Township, US 33 367

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