ELECTRONIC PACKAGE
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United States of America Patent
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N/A
Issued Date -
Jun 22, 2017
app pub date -
Mar 8, 2016
filing date -
Dec 22, 2015
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
An electronic package is provided, which includes a substrate and an antenna board structure disposed on the substrate. The antenna board structure has a first portion, a second portion and a partition portion between the first portion and the second portion. As such, current can be split into two paths so as to spread electromagnetic radiation, and thus produce electromagnetic radiation with a high bandwidth.
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