BUMP STRUCTURE HAVING FIRST PORTION OF COPPER AND SECOND PORTION OF PURE TIN COVERING THE FIRST PORTION, AND INTERCONNECT STRUCTURE USING THE SAME
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United States of America Patent
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N/A
Issued Date -
Jun 22, 2017
app pub date -
Dec 16, 2015
filing date -
Dec 16, 2015
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A bump structure includes a pad. A passivation layer covers a perimeter of the pad. The passivation layer includes an opening exposing an area of the pad. A first portion is disposed on the pad. The first portion includes a top surface and a sidewall. A second portion covers the top surface and entire sidewall of the first portion.
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